Specification
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Substrate Material: |
Fused silica
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Dimension X-Y-Z: |
55x55x1.0, 55x55x3.0mm
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Clear Aperture : |
90%
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Surface Quality: |
40-20
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Surface Flatness (P-V): |
λ/8@ 632.8nm
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Surface Roughness: |
<0.5nm
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Assembly method: |
High-temperature Bonding
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Chips: |
<0.05mm
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Bubbles: |
No bubbles in optical aperture
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Chemical stability |
Acid and alkali resistance
Corrosion resistance
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